Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_47cc435e1d443f13180f7766df104d9d |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0387 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1071 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1067 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1085 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-0677 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G73-1025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C07C275-40 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-038 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C07C275-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-10 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08G73-16 |
filingDate |
1995-08-22^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
1997-09-16^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a5684c61a4af9fd6111997a81d0c2d62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_20f6fd73333c52530dd0b90822965895 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bf07ec9154cf94c81ccd75ca98901ca9 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ef0cacd9d4c8c83934baf8653b0a6ee http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_560517ae58af2b9362dc3d75f8333ae2 |
publicationDate |
1997-09-16^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-5668248-A |
titleOfInvention |
Photosensitive resin composition |
abstract |
A photosensitive resin composition comprising, as its main ingredient, a poly(amic acid) resin constituted of a diamino compound represented by formula: <IMAGE> (I) and optionally used other diamino compound and a tetracarboxylic acid dianhydride as its constituent monomers and/or a poly(amic acid) ester resin obtained by esterifying said poly(amic acid) resin and/or a polyimide resin obtained by a dehydrating or alcohol-eliminating ring-closure reaction of said poly(amic acid) resin or poly(amic acid) ester resin has an excellent developability and a high film strength and can form a relief patter of low thermal expansion. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6077924-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5847071-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7368205-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006280881-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011172324-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005031994-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6329494-B1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1513014-A3 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1513014-A2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6096850-A http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8722758-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009004597-A1 |
priorityDate |
1992-01-20^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |