| abstract |
A soldering method, which secures reliable joints without using flux, is disclosed. Soldering is performed using an auxiliary connecting material capable of physically destroying and dispersing an oxide film, which is naturally grown on the surface of a main connecting material such as solder or brazing between two terminals, to realize a reliable solder wetting (a state of the main connecting material being fused and mixed). For an auxiliary connecting material, hydrocarbon such as n-tetradecane (C14H30), for example, can be used. N-tetradecane boils between connection surfaces and cubically expands; energy generated therefrom physically disperses the oxide film and causes a fresh surface to be exposed; solders on both terminals are mixed; and an electrical and mechanical joint is securely achieved. The residue of the auxiliary connecting material is an insulating material, and therefore does not need cleaning. An excellent electrical joint which is moisture-resistant as well as highly reliable is attained. |