| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F01P5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-467 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-34
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-467
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K7-20 |
| filingDate |
1996-07-15^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
1998-04-07^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_d44cac2555dc9954d27ea7a72e96c443
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e11c3237caea11f7ff2c68979c9e6678
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4236d760750e74449cfc1e852b49d5e7 |
| publicationDate |
1998-04-07^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-5737171-A |
| titleOfInvention |
Switched management of thermal impedence to reduce temperature excursions |
| abstract |
Systems and methods for reducing the thermal stresses between an integrated circuit package and a printed circuit board, each having different thermal coefficients of expansion, to minimize thermal fatigue induced by power management cycling. The thermal impedance of the convection cooling system used with the integrated circuit package is switched with the state of the power management signal. A fan on the integrated circuit package heat sink is energized when the integrated circuit is operated in a high power mode and disabled when the integrated circuit is in a low power mode initiated by the power management system. The switching is directly responsive to the power management system and without regard to integrated circuit package temperature. The switching of the fan alters the thermal impedance to reduce the extremes of the temperature excursion and to materially reduce the rate of change of temperature experienced by the integrated circuit package. Relative temperature induced stresses on the connection between the printed circuit board and integrated circuit package are decreased. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10613600-B2
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10592080-B2 |
| priorityDate |
1996-07-15^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |