http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5920791-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_57341227c065dbddd1d3cf801bbaa86a
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76819
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
filingDate 1997-11-06^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1999-07-06^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7e228e8dbbd794c8927fe182f30ddb55
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a4072f72af23a8ee217a48edd4eb8a19
publicationDate 1999-07-06^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-5920791-A
titleOfInvention Method of manufacturing intermetal dielectrics for sub-half-micron semiconductor devices
abstract A method of gap filling in the intermetal dielectric layer is described. Semiconductor device structures are provided in and on a semiconductor substrate and covered with an insulating layer. A conducting layer is deposited overlying the insulating layer and patterned wherein a gap is formed between portions of the patterned conducting layer. In a deposition chamber, the following steps are repeated until the gap is completely filled: a) depositing an oxide layer over the patterned conducting layer wherein an oxide overhang is formed on either side of the gap, and b) etching away the oxide overhang. The second conducting layer may now be deposited and patterned completing the fabrication of the integrated circuit device.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004048480-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6153509-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012267340-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6908361-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9005459-B2
priorityDate 1997-11-06^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5627104-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5382547-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5334552-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5098865-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5426076-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5294294-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5354715-A
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID14917
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419559562

Showing number of triples: 1 to 27 of 27.