http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5933721-A

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classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-823828
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classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-8238
filingDate 1997-04-21^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1999-08-03^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ac77a6cafe1ab041c02aec7b317f8a60
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a97d80693cb17b2bfa3b54987a53eae1
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publicationDate 1999-08-03^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-5933721-A
titleOfInvention Method for fabricating differential threshold voltage transistor pair
abstract A method of establishing a differential threshold voltage during the fabrication of first and second IGFETs having like conductivity type is disclosed. A dopant is introduced into the gate electrode of each transistor of the pair. The dopant is differentially diffused into respective channel regions to provide a differential dopant concentration therebetween, which results in a differential threshold voltage between the two transistors. One embodiment includes introducing a diffusion-retarding material, such as nitrogen, into the first gate electrode before the dopant is diffused into the respective channel regions, and without introducing a significant amount of the diffusion-retarding material into the second gate electrode. Advantageously, a single dopant implant can provide both threshold voltage values. The two threshold voltages may be chosen to provide various combinations of enhancement mode and depletion mode IGFETs.
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