http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-5981393-A

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eda542721b5af3c5a47c4af1095cc831
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C17-006
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C17-00
filingDate 1997-09-29^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 1999-11-09^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_037ba049f8701ccc374eb9eb455332f0
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_421fb08dd36aa355ec56200454c7a4b1
publicationDate 1999-11-09^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-5981393-A
titleOfInvention Method of forming electrodes at the end surfaces of chip array resistors
abstract A method of forming electrode at the end surface of chip array resistors utilizes the vacuum metallization technology such as sputtering evaporating deposition or ion implanting accompanying a metal mask for forming electrode at the end surfaces of chip array resistors. A blank base can be used instead of a punch-through base which has to be used in conventional technology. The method disclosed in the present invention may greatly increase the productivity of the electrodes, and at the same time, the variation of resistance value of the chip array resistor is minimized and the product quality may be improved.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6577225-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8395132-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8692219-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8093597-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008315129-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007075826-A1
priorityDate 1997-09-29^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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