| abstract |
A sputtering target comprising a main component having magnetic properties and consisting of a metal or an alloy, and a sub-component comprising at least one component selected from the group consisting of a non-magnetic metal and a semiconductor. The main component may be a metal selected from the group consisting of Co, Ni and Fe or may be an alloy of at least two metals selected from the group consisting of Co, Ni and Fe. The sub-component may comprise at least one nonmagnetic metal selected from the group consisting of Ti, Zr, Hf, V, Nb, Ta, Cr, Sn and Pb, or may comprise at least one semiconductor selected from the group consisting of Si and Ge, or may be a mixture of the at least one nonmagnetic metal and the at least one semiconductor. |