| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_6553f9a86c9fe3170954b2f33826289a |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0959
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-095
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-4602
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0239
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2201-0215 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-0094
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-46
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-09 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 |
| filingDate |
1998-11-12^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2001-02-27^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9451b7d1fbf5261c56a2999f4a3c8e9a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0c7706a2f681db9c43629e2be7063b0b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2f5cd12e73d9744b0ba62173a75c7e70
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e82d25b7a928224878b0f6e5e8db08e5 |
| publicationDate |
2001-02-27^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6193910-B1 |
| titleOfInvention |
Paste for through-hole filling and printed wiring board using the same |
| abstract |
A paste for filling through-holes of a printed wiring board contains 100 parts by weight of an epoxy resin composition containing 90 to 99.5 parts by weight of an epoxy resin and 0.5 to 10 parts by weight of a curing agent; and (B) 500 to 1000 parts by weight of a metallic filler having an average particle size of 0.5 to 20 mum. The paste has a viscosity of not higher than 20,000 poise at 25° C. and a volatile content of not more than 1.0% when heated in a filling step. The paste exhibits such shrink-resistance properties that when a first cured resin obtained by heating in a filling step is re-heated and cooled in a solder reflow step to obtain a second cured resin, the shrinkage percentage of the first cured resin to the second cured resin in the longitudinal direction of the through-hole is not greater than 0.1%. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010263432-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011193583-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2056343-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103716983-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102009000491-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006121148-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-102009000491-B4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008035380-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004007068-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7948252-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6898974-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8427183-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7183497-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008272794-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8373428-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005051356-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007126443-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7737709-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005126818-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8485418-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011057018-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-3771303-A4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7851359-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11259412-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006155010-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2020120798-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016095227-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008048688-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1385204-A3
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7291789-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009291573-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-1385204-A2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8470226-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10321578-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009121345-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/DE-10330047-B4
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-103716983-A |
| priorityDate |
1997-11-11^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |