| abstract |
A circuit module includes at least one high temperature semiconductor chip having chip pads; a substrate having substrate metallization, the chip pads and the substrate metallization being substantially planar; and a deposited flexible pattern of electrical conductors capable of withstanding high temperatures and coupling selected chip pads and portions of the substrate metallization. The deposited flexible pattern of electrical conductors includes a plurality of integral interconnect segments, at least one of the integral interconnect segments including first and second leg portions and a shelf portion with the shelf portion being spaced apart from the at least one semiconductor chip and substrate and being coupled by the first leg portion to a selected chip pad and by the second leg portion to a selected portion of the substrate metallization. |