http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6338804-B1

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filingDate 1999-08-09^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2002-01-15^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_514e7863f2600ee4243cf6cc7e8a7a03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3f5ad5eda1bf827f01c9eaf04685ef04
publicationDate 2002-01-15^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-6338804-B1
titleOfInvention Method for removing conductive portions
abstract There is provided a method for removing conductive portions, comprising the steps of: a first process for removing a conductive portion formed on a dielectric using a laser; and a second process for removing an affected layer produced in the removed portion by the laser using a short pulse laser. According to the above described method, the number of steps therein is reduced, conductive portions are removed without using a large number of apparatuses, and deterioration of “Q o ” does not occur.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2003201848-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6809612-B2
priorityDate 1998-08-24^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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