| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0e433c1625fc509a087c912b440da84b |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76831
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-28562
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76888
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02178
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02252
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02255 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-285
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-316 |
| filingDate |
2000-05-18^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2003-04-08^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f646721cc883683fdbfdcf610d5dea5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_09456913b1d5c6b3564faad251b609ee
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2d4db99144686c2274a1dbc796dcb473
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ea02d005c89a97909e995c57586d5b4f |
| publicationDate |
2003-04-08^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6544886-B2 |
| titleOfInvention |
Process for isolating an exposed conducting surface |
| abstract |
A method of isolating an exposed conductive surface. An aluminum layer ( 130 ) is selectively formed over the exposed conductive ( 106 ) surface (e.g., Cu) but not over the surrounding dielectric ( 110 ) surface using a thermal CVD process. The aluminum layer ( 130 ) is then oxidized to form a thin isolating aluminum-oxide ( 108 ) over only the conductive surface. The isolating aluminum-oxide provides a barrier for the Cu while taking up minimal space and reducing the effective dielectric constant. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7476614-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2006017168-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7501706-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007032074-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8835762-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6893978-B1 |
| priorityDate |
1999-06-24^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |