| abstract |
A package includes both a flip chip mounted active chip component and a passive chip component. To form the package, a solder paste is screened onto a passive chip component contact on an upper surface of a substrate. A terminal of the passive chip component is aligned with the solder paste. The solder paste is melted to form a solder joint between the passive chip component contact and the terminal. Solder flux residue from the solder paste is removed. A solder bump is formed on a bond pad of an active chip component. The solder bump is aligned with an active chip component contact on the upper surface of the substrate. The solder bump is melted to form a bump between the active chip component contact and the bond pad, wherein the solder joint does not melt during the melting of the solder bump. |