patent/US-6727576-B2

http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-6727576-B2

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filingDate	2001-10-31^^<http://www.w3.org/2001/XMLSchema#date>
grantDate	2004-04-27^^<http://www.w3.org/2001/XMLSchema#date>
inventor	http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2862972f7075f0aafd12a98f70296f97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a39e8b1d70dea2ec3b6a25b3458bc38f http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3aba78ffac0f6df154d950cac9102e0d
publicationDate	2004-04-27^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber	US-6727576-B2
titleOfInvention	Transfer wafer level packaging
abstract	A semiconductor structure and a method for forming the semiconductor structure, including a semiconductor chip and a conductive layer disposed over a portion of the chip, the conductive layer having a portion that extends beyond an edge of the chip. The chip includes a device, which can be an integrated circuit or a micro-mechanical device. The structure can also include a front layer extending beyond the edge of the chip, the conductive layer being disposed on the front layer.
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