| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_222fb36fbafe251df3d356ff9372fa32 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-424
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C25D5-56 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D7-12
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-54
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C25D5-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-42 |
| filingDate |
2002-02-21^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2005-03-15^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_13a81bce3469db20289d97295179b2c5
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_99b0aa7f273ea116a697d1bda324fdc5 |
| publicationDate |
2005-03-15^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-6866764-B2 |
| titleOfInvention |
Processes for fabricating printed wiring boards using dendritic polymer copper nanocomposite coatings |
| abstract |
An inexpensive process for depositing an electrically conductive material on selected surfaces of a dielectric substrate may be advantageously employed in the manufacture of printed wiring boards having high quality, high density, fine-line circuitry, thereby allowing miniaturization of electronic components and/or increased interconnect capacity. The process may also be used for providing conductive pathways between opposite sides of a dielectric substrate and in decorative metallization applications. The process includes steps of depositing a radially-layered dendritic copolymer on selected surfaces of a dielectric substrate; cross-linking the radially-layered dendritic copolymer to form a dendritic polymer network; sorbing metal cations into the cross-linked dendritic polymer network; reducing the metal cations to form a nanocomposite composition exhibiting adequate surface electrical conductivity for electroplating; and electroplating a metal onto the nanocomposite composition to form an electrically conductive deposit. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012123574-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011110723-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9228092-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011209909-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008207981-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7013562-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010209193-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2009042228-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009075102-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9308616-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8569631-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010232883-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7963720-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8206062-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009104405-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/WO-2014179120-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8585885-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010227381-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9446953-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2004187310-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7976241-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011091283-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2005186774-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8057682-B2 |
| priorityDate |
2002-02-21^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |