| abstract |
Silicone resins comprising 5 to 50 mole % of (PhSiO 3-x)/2 (OH) x ) units and 50 to 95 mole % (HSiO (3-x)/2 (OH) x ), where Ph is a phenyl group, x has a value of 0, 1 or 2 and wherein the cured silicone resin has a critical surface free energy of 30 dynes/cm or higher. These resins are useful as etch stop layers for organic dielectric materials having a critical surface free energy of 40 dynes/cm or higher. |