| abstract |
Stable non-photosensitive polyimide precursor compositions with an adhesion promoter in a non-NMP solvent for use in forming high temperature resistant relief images and a process for making said images. The non-photosensitive polyimide precursor compositions comprisen a) one or more polyamic acids soluble in gamma-butyrolactone (GBL) and aqueous tetramethyl ammonium hydroxide, and with the proviso that the polyamic acid is also resistant to a solvent used in a photosensitive composition with which the polyimide precursor composition is to be used; b) a solvent comprising gamma-butyrolactone; and c) one or more adhesion promoters selected from structures described by Formulae I–VI n nwherein R 1 is H, C 1 –C 10 linear, cyclic or branched alkyl, phenyl or halophenyl or alkyl substituted phenyl, R 2 is C 1 –C 10 linear, cyclic or branched alkyl, phenyl, halophenyl or alkyl substituted phenyl or one of the following moieties VII, VIII, or IX n nwhere R 3 is C 1 –C 4 linear or branched alkyl or C 1 –C 4 linear or branched alkoxy group, R 4 , R 5 and R 6 are independently C 1 –C 4 linear or branched alkyl group, m is an integer from 1 to about 4, and n is an integer from 1 to about 5. |