| abstract |
In preferred embodiments, a polydentate pore-sealing ligand is used to seal or repair pores damaged by plasma processing. The polydentate ligand includes bidentate ligands corresponding to the general formula X—CH 2 —(CH 2 ) n —CH 2 —X or X—Si(CH 3 ) 2 —(CH 2 ) n —Si(CH 3 ) 2 —X. The polydentate ligand also includes tridendate ligands corresponding to the general formula X—CH 2 —(CH 2 ) m (CXH)(CH 2 ) o —CH 2 —X or X—Si(CH 3 ) 2 —(CH 2 ) m (CXH)(CH 2 ) o —Si(CH 3 ) 2 —X. Alternative embodiments may include single or multiply branched polydentate ligands. Other embodiments include ligands that are cross-linked after attachment to the dielectric. Still other embodiments include a derivatization reaction wherein silanol groups formed by plasma damage are removed and favorable dielectric properties are restored. |