| abstract |
An adhesive film including a reactive adhesive capable of curing by heating or light irradiation and a polyphthalide represented by the formula I: n nwherein R represents a divalent aromatic hydrocarbon group or a divalent heteroring-containing aromatic group, R 1 represents an alkyl group, a Fluorinated alkyl group, an alkoxy group or a halogen atom, where the number of R 1 is 0 to 4, X represents O or N—R 3 , provided that R 3 represents one of the following groups,n n nY represents SO 2 or CO and n represents a number of repeating units in the polymer. The adhesive film can be used to connect, e.g., electrodes of a semiconductor chip to electrodes of a wiring board. The polyphthalide can be used to surface-treat, e.g., electrodes of a wiring board. |