| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76844
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-0217
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76802
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76888
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76834
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02252
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-32053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53238
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76877
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5329
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53209
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5283
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76865
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76849
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76856 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-44 |
| filingDate |
2005-06-03^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-07-22^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b45558505929cbf76e175ac2c2df197f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_657fcd061f5476474c252bca7fdd43df
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c40550a0065756b6514a132df9e8e040
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_91275181c041b0f13a2ad9b38ab28a3f |
| publicationDate |
2008-07-22^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7402519-B2 |
| titleOfInvention |
Interconnects having sealing structures to enable selective metal capping layers |
| abstract |
Methods of fabricating a capped interconnect for a microelectronic device which includes a sealing feature for any gaps between a capping layer and an interconnect and structures formed therefrom. The sealing features improve encapsulation of the interconnect, which substantially reduces or prevents electromigration and/or diffusion of conductive material from the capped interconnect. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008277797-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8354751-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8920617-B1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009309226-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8446012-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9460988-B2 |
| priorityDate |
2005-06-03^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |