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filingDate 2006-10-20^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2008-08-19^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7413671-B2
titleOfInvention Method of fabricating a printhead integrated circuit with a nozzle chamber in a wafer substrate
abstract A method of fabricating a printhead integrated circuit includes the step of forming a first layer of a polymeric material on a substrate that incorporates drive circuitry. A heater element is formed on the first layer of polymeric material to be connected to the drive circuitry. A second layer of a polymeric material is formed on the heater element and the first layer such that the heater element is embedded in polymeric material. The polymeric layers are etched to define a plurality of radially extending bridging portions which terminate in a nozzle rim and a plurality of actuators which each extend between a respective pair of adjacent bridging portions and each terminate in a free end proximal to the rim. The substrate is etched so that the substrate and the actuators define a nozzle chamber in fluid communication with an ink ejection port defined by the nozzle rim.
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