| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31504
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10S425-81
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24851 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76817
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76807
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G03F7-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y10-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B82Y40-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C33-38
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C03C17-22
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G03F7-00 |
| filingDate |
2004-03-13^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2008-10-14^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_74bcb9c1f09e52bb92420807b1e286dc
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b7631b6bf2080ee446fbb1aa8ceed6b3
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_e8491f32977edc2b62d64ebf465b97f7
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c532e1e1b32a5ebd47359b7667fbfd13 |
| publicationDate |
2008-10-14^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7435074-B2 |
| titleOfInvention |
Method for fabricating dual damascence structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascence patterning |
| abstract |
The process of producing a dual damascene structure used for the interconnect architecture of semiconductor chips. More specifically the use of imprint lithography to fabricate dual damascene structures in a dielectric and the fabrication of dual damascene structured molds. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2012139001-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7815430-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8007631-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102001618-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102001618-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9515205-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102646625-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014034125-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011042352-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8361336-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2007283883-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/CN-102646625-A
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008211133-A1 |
| priorityDate |
2004-03-13^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |