http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-7652379-B2

Outgoing Links

Predicate Object
assignee http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a0f26a9c2efad3ae086a108f3c04b57d
classificationCPCAdditional http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00011
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05096
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85207
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01015
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48624
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48647
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02166
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48824
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-023
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48847
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45147
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-05042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19043
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04042
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05073
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05093
classificationCPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48
filingDate 2007-08-27^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2010-01-26^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b5d7b653a3b433342c8d21766d0ff2a
publicationDate 2010-01-26^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7652379-B2
titleOfInvention Bond pad stacks for ESD under pad and active under pad bonding
abstract A combination of layout improvements and inner layer dielectric (ILD) material improvements provides a bond pad stack that is robust for both gold (Au) and copper (Cu) wires in circuits with only one or two pad metal layers. The layout improvements involve removing all vias between the top metal layer and the metal layers below top metal in the area under the passivation opening (where probe tips and the bond wire are placed). This allows for a more homogenous material without via discontinuities, thereby reducing stress concentration points in the ILD. The ILD material improvement involves adding a layer of silicon nitride in addition to the silicon oxide layer. Traditionally, the ILD consists of either spun-on or high density plasma (HDP) oxides. The growth of the thin layer of silicon nitride over the oxide on the topmost ILD layer provides a composite of significantly increased toughness and prevents cracks or other damage from propagating into the underlying active circuits and routing.
isCitedBy http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8247905-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9721890-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009294989-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2503594-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11508683-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9620460-B2
priorityDate 2007-07-23^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

Incoming Links

Predicate Subject
isDiscussedBy http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID24261
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID77987
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID457707758
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23985
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID482532689
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419522015
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID3084099
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID5359268
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID129581052
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID23978
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID425270609
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID418354341
http://rdf.ncbi.nlm.nih.gov/pubchem/anatomy/ANATOMYID1969
http://rdf.ncbi.nlm.nih.gov/pubchem/substance/SID419491804
http://rdf.ncbi.nlm.nih.gov/pubchem/compound/CID69667

Showing number of triples: 1 to 66 of 66.