Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a0f26a9c2efad3ae086a108f3c04b57d |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00011 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05624 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05096 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85207 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01015 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05647 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01014 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48624 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48647 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-02166 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48824 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48847 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45147 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-05042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-19043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01074 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-04042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05073 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-05093 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-03 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
filingDate |
2007-08-27^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2010-01-26^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5b5d7b653a3b433342c8d21766d0ff2a |
publicationDate |
2010-01-26^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-7652379-B2 |
titleOfInvention |
Bond pad stacks for ESD under pad and active under pad bonding |
abstract |
A combination of layout improvements and inner layer dielectric (ILD) material improvements provides a bond pad stack that is robust for both gold (Au) and copper (Cu) wires in circuits with only one or two pad metal layers. The layout improvements involve removing all vias between the top metal layer and the metal layers below top metal in the area under the passivation opening (where probe tips and the bond wire are placed). This allows for a more homogenous material without via discontinuities, thereby reducing stress concentration points in the ILD. The ILD material improvement involves adding a layer of silicon nitride in addition to the silicon oxide layer. Traditionally, the ILD consists of either spun-on or high density plasma (HDP) oxides. The growth of the thin layer of silicon nitride over the oxide on the topmost ILD layer provides a composite of significantly increased toughness and prevents cracks or other damage from propagating into the underlying active circuits and routing. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8247905-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9721890-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2009294989-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/EP-2503594-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11508683-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9620460-B2 |
priorityDate |
2007-07-23^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |