| abstract |
The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer ( 2 ) on a substrate material ( 1 ) and a die-bonding adhesive layer ( 3 ) on the pressure-sensitive adhesive layer ( 2 ), wherein the adhesion of the pressure-sensitive adhesive layer ( 2 ) to the die-bonding adhesive layer ( 3 ), as determined under the conditions of a peel angle of 15° and a peel point moving rate of 2.5 mm/sec. at 23° C., is different between a region ( 2 a ) corresponding to a work attachment region ( 3 a ) and a region ( 2 b ) corresponding to a part or the whole of the other region ( 3 b ), in the die-bonding adhesive layer ( 3 ), and satisfies the following relationship: adhesion of the pressure-sensitive adhesive layer ( 2 a ) <adhesion of the pressure-sensitive adhesive layer ( 2 b ), and the adhesion of the pressure-sensitive adhesive layer ( 2 a ) to the die-bonding adhesive layer ( 3 ) is not higher than 2.3 N/25 mm. |