| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_3a2e282f0e21515fa8a4a7a96311435b |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-06727
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R31-2891 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C26-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07357
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/G01R1-07378 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G01R31-28 |
| filingDate |
2007-09-12^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2011-01-25^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_23c6925eed1bccb34c2630cf2fd2e244
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6f3e31f280b0105979876e770ead37e2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_49822eaac39b534fcdce3b967f355c88 |
| publicationDate |
2011-01-25^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-7876087-B2 |
| titleOfInvention |
Probe card repair using coupons with spring contacts and separate atachment points |
| abstract |
Probecard architectures partition the spring compliance required for IC testing between several different components. Such architectures can provide shorter springs, better impedance control, improved power/ground distribution and more direct paths to tester electronics. The probecards can also use thinner interconnector substrates to conform to the planarity of a DUT and may suspend such a substrate by wires attached to a perimeter edge of the substrate to permit the substrate to tilt. Tilting can also be facilitated by positioning tester-side springs away from the perimeter of the substrate. Low compliance MEMS probes for such architectures can be provided on replaceable coupons having attachment points away from electrical connections, and a method for fabricating probe springs can plate spring material on a membrane deformed by contact with a bumped substrate. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017200657-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10177021-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9372205-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015198631-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011288674-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2010294545-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I797770-B
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016305981-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2015123690-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8156641-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10119995-B2 |
| priorityDate |
2006-09-12^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |