Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e0c373caa4d8befc03d1c7e7bc21ea5b |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-07802 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01006 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48091 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-85 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-81 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01029 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-1023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-83 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3511 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-85 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1517 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15153 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-45144 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15331 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-18161 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-181 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01082 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01079 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-45 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-81801 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-97 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-83 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-105 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-043 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3121 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-49 |
filingDate |
2008-04-21^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2011-03-22^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_178288d33b7f4c21c1a70991f0bb382b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5cc612571c040f52b75aa3fd3e94496e |
publicationDate |
2011-03-22^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-7911047-B2 |
titleOfInvention |
Semiconductor device and method of fabricating the semiconductor device |
abstract |
A semiconductor device includes: a package substrate that includes a recessed portion, with electrode pads that are electrically connected to electrodes of the semiconductor chip being formed inside the recessed portion; a semiconductor chip that is housed in the recessed portion; terminal-use wires that are formed on the surface of the package substrate and are electrically connected to the electrode pads; external connection pads that are formed on a back surface of the package substrate and are electrically connected to the electrode pads; a sealing resin portion that includes a grinded surface that is parallel to the surface of the package substrate, and seals at least the semiconductor chip by a sealing resin; rewiring pads that are formed on the grinded surface; and connecting wires that are formed on the grinded surface and electrically interconnect the terminal-use wires and the rewiring pads. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8598034-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016293653-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8461696-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011175213-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9881962-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10658187-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011006413-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2016351481-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9812385-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8334601-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8569892-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017301658-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2011254172-A1 |
priorityDate |
2007-04-27^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |