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filingDate 2008-04-21^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2011-03-22^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-7911047-B2
titleOfInvention Semiconductor device and method of fabricating the semiconductor device
abstract A semiconductor device includes: a package substrate that includes a recessed portion, with electrode pads that are electrically connected to electrodes of the semiconductor chip being formed inside the recessed portion; a semiconductor chip that is housed in the recessed portion; terminal-use wires that are formed on the surface of the package substrate and are electrically connected to the electrode pads; external connection pads that are formed on a back surface of the package substrate and are electrically connected to the electrode pads; a sealing resin portion that includes a grinded surface that is parallel to the surface of the package substrate, and seals at least the semiconductor chip by a sealing resin; rewiring pads that are formed on the grinded surface; and connecting wires that are formed on the grinded surface and electrically interconnect the terminal-use wires and the rewiring pads.
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http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10658187-B2
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