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publicationNumber US-7931988-B2
titleOfInvention Tin and tin-zinc plated substrates to improve Ni-Zn cell performance
abstract An improved Ni—Zn cell with a negative electrode substrate plated with tin or tin and zinc during manufacturing has a reduced gassing rate. The copper or brass substrate is electrolytic cleaned, activated, electroplated with a matte surface to a defined thickness range, pasted with zinc oxide electrochemically active material, and baked. The defined plating thickness range of 40-80 μIn maximizes formation of an intermetallic compound Cu 3 Sn that helps to suppress the copper diffusion from under plating layer to the surface and eliminates formation of an intermetallic compound Cu 6 Sn 5 during baking to provide adequate corrosion resistance during battery operation.
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