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http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-405
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C23C16-45525
classificationIPCInventive http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C23C16-18
filingDate 2008-06-05^^<http://www.w3.org/2001/XMLSchema#date>
grantDate 2011-09-06^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1e2f66363046427984a32c012944be89
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_bca74b0255e0f104aa7e51fbdbec18fb
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publicationDate 2011-09-06^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8012536-B2
titleOfInvention Method of forming metal-containing layer using organometallic compounds
abstract Methods of forming metal-containing layers are provided where heteroleptic organometallic compounds containing at least one formamidinate ligand are conveyed in a gaseous form to a reactor; and films comprising a metal are deposited on a substrate. These heteroleptic organometallic compounds have improved properties over conventional vapor deposition precursors. Such compounds are suitable for use as vapor deposition precursors including direct liquid injection. Also provided are methods of depositing thin films, such as by ALD and CVD, using such compounds or their solutions in organic solvents.
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