http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8026185-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_c186e9ae8cafab5df5c8d80cfa7b0fa1 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2baf849d216e689ecc40ccc931a7a7bc |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K10-466 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K10-471 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K10-466 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K10-84 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H10K71-611 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-00 |
| filingDate | 2007-08-03^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2011-09-27^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_eb41c39f1b54e88fd2800e3b6ab14044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c24856c50d59e7a93d2d1037c5c88cc5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6816454ee6cd1829c001d546a810def5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01a918b41e3e646338b9dcfb9fbc1481 |
| publicationDate | 2011-09-27^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-8026185-B2 |
| titleOfInvention | Method for manufacturing electronic circuit component |
| abstract | An object of the present invention is to provide a method for manufacturing an electronic circuit component such as an organic TFT 1 , which can manufacture an electronic circuit component excellent in reliability and having quality on a practical level, because an insulating layer and a conductive layer which have more excellent characteristics can be formed, particularly, on a general-purpose plastic substrate or the like by treatment at a process temperature of 200° C. or lower which has no influence on the above-mentioned plastic substrate. n The method for manufacturing an electronic circuit component according to the invention includes heating a layer containing at least one of a polyimide and a precursor thereof at a temperature of 200° C. or lower to form an insulating layer 4 having a contact angle with water of 80° or more, forming a coating film including a dispersion containing metal nanoparticles on the above-mentioned insulating layer 4 and heating the above-mentioned coating film at a temperature of 200° C. or lower to form a conductive layer such as a source layer 5 or a drain layer 6. |
| priorityDate | 2006-08-07^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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