abstract |
The present invention relates to hotmelt adhesive compositions which comprise at least one thermoplastic polyolefin (P) which is solid at 25° C., and also at least one amide (A) of the formula (I) or (II). n These hotmelt adhesive compositions are suitable more particularly for the adhesive bonding of polyolefin films. More particularly it is possible to form assemblies of a substrate (S) and polyolefins bonded with a hotmelt adhesive. |