Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_2e98f6d1d5c0f77cd5da527947503a4f http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8a08040556c3e7204d92b901b9bda748 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_cb04eda027b1b2cc5629963de49fd068 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12042 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L27-0248 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5222 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5223 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5227 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5283 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53295 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5329 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5286 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76801 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-62 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L24-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76838 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L27-02 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L29-40 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-52 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-528 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-60 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-62 |
filingDate |
2007-09-17^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2012-05-29^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_7ef01daa1666b008d3c8938b12605ec8 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_01343b9ae478f212634805cf4bc8b8b4 |
publicationDate |
2012-05-29^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-8188603-B2 |
titleOfInvention |
Post passivation interconnection schemes on top of IC chip |
abstract |
A new method is provided for the creation of interconnect lines. Fine line interconnects are provided in a first layer of dielectric overlying semiconductor circuits that have been created in or on the surface of a substrate. A layer of passivation is deposited over the layer of dielectric, a thick second layer of dielectric is created over the surface of the layer of passivation. Thick and wide interconnect lines are created in the thick second layer of dielectric. The first layer of dielectric may also be eliminated, creating the wide thick interconnect network on the surface of the layer of passivation that has been deposited over the surface of a substrate. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008042293-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8461686-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008042285-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8435883-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008045002-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2008067686-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8482127-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8492900-B2 |
priorityDate |
2000-10-18^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |