| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_02cfbd5a731bb47d7966ee3e1c382a0d
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_abed29833e4ec438c5922a2281a42517
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_41cf4b884ce3051cc1c19f77d2c0570b
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_98d8cc42daa9d43733c041a17d5260d1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d9568f4ecc2bba6fe63e4f8a70225499
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_0f12be99889b1496f9108d8b56776b90
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e60c38fa6b721d3ea5a0c33f030a616e |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M50-124
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y02P70-50 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M50-531
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M50-543
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M50-528
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M6-40
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01M50-124 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01M50-528 |
| filingDate |
2008-04-29^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2013-03-12^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cbfea5b901b8b06a246db80660c8deec
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c3ace87fb76b244291a9e81f35aad8b1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9ef42d7a45b983d00f21068ebe727e2f
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_fbd6b68b3743d1be324649c357afc983
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_194b090a6c686f27b36d34133ca6a39e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2727447822bb345623141e27248cf713 |
| publicationDate |
2013-03-12^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-8394522-B2 |
| titleOfInvention |
Robust metal film encapsulation |
| abstract |
The present invention relates to metal film encapsulation of an electrochemical device. The metal film encapsulation may provide contact tabs for the electrochemical device. The present invention may also include a selectively conductive bonding layer between a contact and a cell structure. The present invention may further include ways of providing heat and pressure resilience to the bonding layer and improving the robustness of the protection for the cell structure. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10660208-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10573924-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018069261-A1
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11101513-B2 |
| priorityDate |
2002-08-09^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |