http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8412348-B2
Outgoing Links
Predicate | Object |
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assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ec4d11225860d6686b11dd55b76a3a05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_170abc60359a722c65cebefd24a5bcfb http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b9614fd7323c16d37f76c43ff826cfdc http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_91fe1cddc99f9255118b5a663deed0fc |
classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-3787 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N2001-0585 |
classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/A61N1-057 |
classificationIPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-378 |
classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61N1-05 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/A61F2-89 |
filingDate | 2004-05-06^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate | 2013-04-02^^<http://www.w3.org/2001/XMLSchema#date> |
inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_38402e16d7f8c0d04cd17ab3c55d8496 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_df51ae0d2ddd6652662b4fcb53d370cf http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ed9a211d2eeb066f9406674247edddfe |
publicationDate | 2013-04-02^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber | US-8412348-B2 |
titleOfInvention | Intravascular self-anchoring integrated tubular electrode body |
abstract | An expandable intravascular medical device is provided. The medical device comprises an expandable tubular body that includes an integrated resilient support structure that forms a plurality of electrically conductive regions to which the lead(s) is coupled. The tubular body further includes at least one electrically insulative element disposed between the conductive regions. In one embodiment, the support structure is skeletal in nature, e.g., it can be formed of a mesh, braid, or coil. The conductive regions can be variously formed by the support structure. For example, the support structure may comprise electrically conductive sub-structures that form the conductive regions. In this case, the sub-structures may be mechanically linked together by the insulative element(s), or they can be directly linked together, and the insulative element(s) can take the form of insulative layer(s) disposed on one or more of the conductive sub-structures. As another example, the support structure can have a conductive core and insulative material disposed over portions of the conductive core. In this case, the exposed core portions form the conductive regions, and the unexposed core portions form the insulative element(s). |
priorityDate | 2004-05-06^^<http://www.w3.org/2001/XMLSchema#date> |
type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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