http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-8502394-B2
Outgoing Links
| Predicate | Object |
|---|---|
| assignee | http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_13f9ddd01ce524be1d4a5518f8d0ac27 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9e41c275febda1a0eeb3a2bbf774caa4 |
| classificationCPCAdditional | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06589 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06555 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06517 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2225-06513 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3128 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16145 |
| classificationCPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-0657 |
| classificationIPCInventive | http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
| filingDate | 2009-12-31^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate | 2013-08-06^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor | http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8932d36c629c7cd6ffcc375d3b41ccf3 |
| publicationDate | 2013-08-06^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber | US-8502394-B2 |
| titleOfInvention | Multi-stacked semiconductor dice scale package structure and method of manufacturing same |
| abstract | A multi-stack semiconductor dice assembly has enhanced board-level reliability and integrated electrical functionalities over a common package foot-print. The multi-stack semiconductor dice assembly includes a bottom die having a stepped upper surface. The stepped upper surface includes a base region and a stepped region, which is raised relative to the base region. The base region includes a plurality of attachment structures that are sized and shaped to receive electrically conductive balls. An upper die is stacked above the bottom die. The upper die includes a plurality of attachment structures that are sized and shaped to receive electrically conductive balls and are arranged to align with the attachment structures of the bottom die. Electrically conductive balls are attached to the attachment structures of the bottom die and the attachment structures of the upper die. |
| isCitedBy | http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10622326-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9287235-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11721657-B2 |
| priorityDate | 2009-12-31^^<http://www.w3.org/2001/XMLSchema#date> |
| type | http://data.epo.org/linked-data/def/patent/Publication |
Incoming Links
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