Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_392e7be202a35c15026cc3a64ced0d79 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_31c7f117b3ff668728c8cf110c83a939 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_8ba46a5ed81e2bb0030c9a022de31535 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e757fd4fedc4fe825bb81b1b466a0947 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_312e094422e5655d7d01005a05769625 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54473 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54433 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54406 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-54413 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-5442 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3011 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76843 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76838 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-76807 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-544 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/G06K9-00 |
filingDate |
2012-01-27^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2013-10-22^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_2c8bf2d392862dac26145f4be6ef1b22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_8b83001b857c97381c5b633ced7cbde0 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_95c0be2abfec2318e16397aa76366882 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_102578864f1f3a30581f5a0a91b02f47 |
publicationDate |
2013-10-22^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-8565510-B2 |
titleOfInvention |
Methods for reading a feature pattern from a packaged die |
abstract |
Methods for tracking the identity of die after singulation from a wafer. The product chips and die include a pattern of features formed in a metallization level of a back-end-of-line (BEOL) wiring structure. The features in the pattern contain information relating to the die, such as a unique identifier that includes a wafer identification used to fabricate the die and a product chip location for the die on a wafer. The features may be imaged with the assistance of a beam of electromagnetic radiation that penetrates into a packaged die and is altered by the presence of the features in a way that promotes imaging. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10366951-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9437569-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9679843-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9929119-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10199346-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9666549-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11251150-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9349703-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9373524-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10861815-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/TW-I550822-B http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10438915-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9741664-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9269701-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10796988-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11515248-B2 |
priorityDate |
2008-08-19^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |