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filingDate 2012-01-27^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2013-10-22^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8565510-B2
titleOfInvention Methods for reading a feature pattern from a packaged die
abstract Methods for tracking the identity of die after singulation from a wafer. The product chips and die include a pattern of features formed in a metallization level of a back-end-of-line (BEOL) wiring structure. The features in the pattern contain information relating to the die, such as a unique identifier that includes a wafer identification used to fabricate the die and a product chip location for the die on a wafer. The features may be imaged with the assistance of a beam of electromagnetic radiation that penetrates into a packaged die and is altered by the presence of the features in a way that promotes imaging.
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