Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4fe11773ea6f024cdfa26c3cbe39ad49 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5f764e93bc7336384b653ea958ac8482 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_584a275f44b1a253884e9751a4469a34 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_eadd3b5d8c7364d753c3c10f9229da8a |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T29-4913 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-1461 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R19-005 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73265 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-48137 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-3025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-092 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C2203-0109 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2201-0257 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B2207-095 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-053 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81C1-0023 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B81B7-007 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H04R19-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-30 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-48 |
filingDate |
2010-04-30^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2014-10-07^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6c350ae177bb471bb7638e8f8c842c91 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_72bd361dddd2b48ff6d2d2be031fb1d5 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3dd58dc553053558a175c3e100df3afe |
publicationDate |
2014-10-07^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-8853564-B2 |
titleOfInvention |
Air cavity package configured to electrically couple to a printed circuit board and method of providing same |
abstract |
In some examples, a semiconductor package can be configured to electrically couple to a printed circuit board. The semiconductor package can include: (a) a lid having one or more first electrically conductive leads; (b) a base having a top, a bottom and one or more sides between the top and the bottom, the base having one or more second electrically conductive leads electrically coupled to the one or more first electrically conductive leads; (c) one or more first semiconductor devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads; and (d) one or more first micro-electrical-mechanical system devices mechanically coupled to the lid and electrically coupled to the one or more first electrically conductive leads. The lid can be coupled to the base and at least one of the lid or the base has at least one port hole. The one or more second electrically conductive leads can be configured to couple to the printed circuit board at a first side of the one or more sides of the base. Other embodiments are disclosed. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9974158-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9991181-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10217686-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10217685-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9793237-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9935026-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2018061725-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9799637-B2 |
priorityDate |
2010-04-30^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |