Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_599f2f570b3a989fa9076f8465318ddc http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_26c475bcbe0c24b485b6f37c45cd921f http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f76aab74ed312003383a8600e2edbd5b |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-29339 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-13055 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-14 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-01322 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09J11-02 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K7-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-14 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-22 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01B1-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J9-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09J11-02 |
filingDate |
2013-03-13^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2015-03-10^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_21ca81a658799322b19a729eeaf9f6de http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_a00049b8d52c32cc1ee88b75a0d96d95 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1692eb83d90204fc9359571e998ad937 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_19850d59afcf08694a00d52ce931a386 |
publicationDate |
2015-03-10^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-8974705-B2 |
titleOfInvention |
Sinterable silver flake adhesive for use in electronics |
abstract |
A conductive composition comprises (i) micro- or submicro-sized silver flake having a tap density of 4.6 g/cc or higher and (ii) a solvent that dissolves any fatty acid lubricant or surfactant present on the surface of the silver. In one embodiment, (iii) a small amount of peroxide is present. No organic resin is present in the composition. |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10000670-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11745294-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11339304-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2014030509-A1 |
priorityDate |
2011-02-25^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |