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publicationDate 2015-03-10^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-8974705-B2
titleOfInvention Sinterable silver flake adhesive for use in electronics
abstract A conductive composition comprises (i) micro- or submicro-sized silver flake having a tap density of 4.6 g/cc or higher and (ii) a solvent that dissolves any fatty acid lubricant or surfactant present on the surface of the silver. In one embodiment, (iii) a small amount of peroxide is present. No organic resin is present in the composition.
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