| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1a69c620ea7d410735aad9677e526efe
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_e50f7d4562a27e0afeb8104c6fbdd300 |
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| classificationCPCInventive |
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| classificationIPCAdditional |
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| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-02
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| filingDate |
2014-10-23^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-04-12^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_9fd79f7d04095a79cf571d79cb9c7ac4
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_196c2d415a3fa9c7bb40d178fe374ab8 |
| publicationDate |
2016-04-12^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9312240-B2 |
| titleOfInvention |
Semiconductor packages and methods of packaging semiconductor devices |
| abstract |
A method of forming semiconductor assemblies is disclosed. The method includes providing an interposer with through interposer vias. The interposer includes first and second surfaces. The through interposer vias extend from the first surface to the second surface of the interposer. The interposer with the through interposer vias enable attachment and electrical coupling of a die having very fine contact pitch to an external device having relatively larger contact pitch. At least a first die is mounted on at least one die attach region on the first surface of the interposer. The first die comprises a first surface with first conductive contacts thereon. The interposer comprises material with CTE similar to that of the first die. The first conductive contacts of the first die are coupled to the through interposer vias on the first surface of the interposer. A bonding process which does not require a reflow process is performed to form connections between the first die and interposer. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11664302-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11195789-B2 |
| priorityDate |
2011-01-30^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |