Predicate |
Object |
assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_16021308c1f8c80ed8e4102eb770b060 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_210b4f1db398c9e04ec46eebd7f7f1dc http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_654f71f916a09aac805ad222e5e84cd7 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_4a20f3b3ab5e80e4f00f3caaf3d8d320 http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_ad2cd796f8c4dcb425ddcc68707d3444 |
classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J2377-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F02F7-0085 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L2205-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-249977 |
classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-013 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C67-2205 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C44-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/F02F7-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C44-3446 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/E04B1-78 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L77-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C44-025 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K7-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-0033 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L25-08 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C44-3457 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C44-02 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L25-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08J9-04 http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B29C44-3442 |
classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/F02F7-00 |
classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08J9-06 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B29C44-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08L77-00 http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/E04B1-78 |
filingDate |
2011-11-01^^<http://www.w3.org/2001/XMLSchema#date> |
grantDate |
2016-09-20^^<http://www.w3.org/2001/XMLSchema#date> |
inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_6e78bb0a8195831f5129068d37ba3507 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_c174e5916f78d84bfe35a92ffce4a897 http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_3ddf48441953ece48e9d98964241709b http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b93cfe970d4f848ce1eac146eca9e9bb |
publicationDate |
2016-09-20^^<http://www.w3.org/2001/XMLSchema#date> |
publicationNumber |
US-9447575-B2 |
titleOfInvention |
Polyamide resin composition, expanded polyamide resin molding, and automotive resin molding |
abstract |
Provided is a polyamide resin composition which can provide an expanded molding being superior in heat resistance and sufficiently reduced in weight and having high load resistance by a simple molding process. The polyamide resin composition is characterized by comprising a polyamide resin (A), a glycidyl-group-containing styrene copolymer (B) having two or more glycidyl groups per molecule, a weight average molecular weight of 4000 to 25000 and an epoxy value of 400 to 2500 Eq/1×10 6 g and an inorganic reinforcing material (C) in a proportion such that the content of the glycidyl-group-containing styrene copolymer (B) is 0.2 to 25 parts by mass and the content of the inorganic reinforcing material (C) is 0 to 350 parts by mass relative to 100 parts by mass of the polyamide resin (A). |
isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2019090581-A1 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10457796-B2 http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11161284-B2 |
priorityDate |
2010-11-01^^<http://www.w3.org/2001/XMLSchema#date> |
type |
http://data.epo.org/linked-data/def/patent/Publication |