| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_b6b9326fc9802ab4c7c8ace781c22561
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_1da4b18bddb46e68d07b52219afb8b0a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_a0b209e91d3aa9eb3fa771914903e7ed |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B1-002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B08B3-04 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-3212
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-53228
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09G1-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-7684
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D11-0047
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-02074
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-266
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C11D7-3209 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B1-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B3-00 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-768
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-532
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B08B3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-02
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-321
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09G1-04 |
| filingDate |
2015-04-09^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2016-11-08^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_83c75f74aa4c265432bb5dfd67690f1e
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_abcedae3a55d4e7fd6fd4b3ea66f2b9c |
| publicationDate |
2016-11-08^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9490142-B2 |
| titleOfInvention |
Cu-low K cleaning and protection compositions |
| abstract |
This disclosure relates post chemical mechanical planarization cleaning composition of semiconductor substrate for advanced electronics fabrication and packaging. It provides novel corrosion inhibition and quality upmost Cu-low K surfaces to the demanding reliability of nano device and Cu interconnection. Its efficacious cleaning without changing of ultra-low K dielectric and interfering with ultimate electronics performance also offers a cleaning solution to the Cu-low K structure of post reactive ion etching as well as resist ashing in semiconductor fabrication process flow. |
| priorityDate |
2015-04-09^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |