| abstract |
A semiconductor device ( 100 ) comprising a leadframe with a pad ( 101 ) and elongated leads ( 103 ) made of a base metal plated with a layer enabling metal-to-metal bonding; a semiconductor chip ( 110 ) attached to the pad, the chip having terminals. A metallic wire connection ( 130 ) from a terminal to a respective lead, the connection including a first ball bond by a first squashed ball ( 131 ) attached to the terminal, and a first stitch bond ( 132 ) attached to the lead. A second squashed ball ( 150 ) of the wire metal attached to the lead as a second ball bond adjacent to the first stitch bond ( 132 ). A package ( 170 ) of a polymeric compound encapsulating the chip, wire connection, second ball and at least a portion of the elongated lead, the compound adhering to the materials of the encapsulated entities. |