| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_51d028c578ae85cb937b5b34a5129fbc |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-0002
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-005
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/B23K26-364
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-563 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-56
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-29
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-78
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-364
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/B23K26-18 |
| filingDate |
2013-03-12^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-04-25^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_b1ad4bba5512fc70e45b92342f22f7f1
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_ad7b67189c74fc6a8026e278b3a3f56a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_0e23997c2a233e0804788b1c4c1db1c2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_1af31859b36b1843f40ec9a742ad30ee |
| publicationDate |
2017-04-25^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9631065-B2 |
| titleOfInvention |
Methods of forming wafer level underfill materials and structures formed thereby |
| abstract |
Methods of forming microelectronic packaging structures and associated structures formed thereby are described. Those methods and structures may include forming a wafer level underfill (WLUF) material comprising a resin material, and adding at least one of a UV absorber, a sterically hindered amine light stabilizer (HALS), an organic surface protectant (OSP), and a fluxing agent to form the WLUF material. The WLUF is then applied to a top surface of a wafer comprising a plurality of die. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10833036-B2 |
| priorityDate |
2013-03-12^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |