| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_f47985b7c371b565f319708450999686 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32145
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2223-6644 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-162
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-5389
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-3107
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-31
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L25-165
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L23-26 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-66
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-538
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-552
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-053
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L23-31 |
| filingDate |
2016-03-10^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-05-30^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_44d35b032805f668cee4a4a9efb047e1 |
| publicationDate |
2017-05-30^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9666538-B1 |
| titleOfInvention |
Semiconductor package with barrier for radio frequency absorber |
| abstract |
Semiconductor packages and methods of manufacturing semiconductor packages are described herein. In certain embodiments, the semiconductor package includes a housing including a first compartment and a second compartment, the first and second compartments being divided from one another. The semiconductor package can also include an integrated device die disposed in the first compartment, and a radio frequency (RF) absorber disposed in the second compartment. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10431512-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11013155-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-2017330812-A1 |
| priorityDate |
2016-03-10^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |