| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_120e514026d8a36961dbf2a9e4a9097a
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_d6402d8eb4f4fab3715e3e6adf11fd32
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_304b83aee2264aed7c97cce39e77a666
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_9027742c5197c0a95849586fcb9da277
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_873f12f107f69c4da9ff18d02de4ff89 |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T156-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K1-0393
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-26
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24942
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-68381
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-23914
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31515
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-2848
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-1383
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2221-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-016
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-281
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-24355
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K2203-0191
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-14
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-1476 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-31138
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L21-6835
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H05K3-007 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K1-03
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-28 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01L21-683
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-00
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H05K3-07 |
| filingDate |
2016-04-12^^<http://www.w3.org/2001/XMLSchema#date> |
| grantDate |
2017-08-01^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_5ca0a95b4b06f43bf0614cb4b23493f8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_f0f19fe1ed7e59c7b3d1282e5f6788f2
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_466b2e5991928a13e94d4fa2360bcec8
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_4eebb083fa6de2840a6a755e1a558255 |
| publicationDate |
2017-08-01^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
US-9721825-B2 |
| titleOfInvention |
Method of providing a flexible semiconductor device and flexible semiconductor device thereof |
| abstract |
Some embodiments include a method. The method can include providing a carrier substrate having an edge. Further, the method can include providing a cross-linking adhesive, and providing a flexible substrate having an edge. Further still, the method can include coupling the flexible substrate to the carrier substrate using the cross-linking adhesive such that at least a portion of the edge of the flexible substrate is recessed from the edge of the carrier substrate and such that the cross-linking adhesive has an exposed portion of the cross-linking adhesive at an offset portion of the first surface of the carrier substrate between the at least the portion of the edge of the flexible substrate and the edge of the carrier substrate. Meanwhile, the method can include etching the exposed portion of the cross-linking adhesive. Other embodiments of related methods and devices are also disclosed. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9923157-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-11385361-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10983226-B2 |
| priorityDate |
2008-12-02^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |