http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9725311-B2

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publicationDate 2017-08-08^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber US-9725311-B2
titleOfInvention Micromechanical component having hermetic through-contacting, and method for producing a micromechanical component having a hermetic through-contacting
abstract A micromechanical component includes: a hermetically sealed housing; a first functional element that is situated inside the housing; a first structured electrically conductive layer that contacts the first functional element and that is situated inside the housing; and a second structured electrically conductive layer, the first conductive layer being electrically contacted via the second conductive layer, and the second conductive layer being electrically contacted laterally through the housing via a hermetic through-contacting in the second conductive layer.
priorityDate 2014-02-17^^<http://www.w3.org/2001/XMLSchema#date>
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