| Predicate |
Object |
| assignee |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_5d4ada69388e0a1b68daaf536597c732
http://rdf.ncbi.nlm.nih.gov/pubchem/patentassignee/MD5_988ba3b5c9fb4bc9c03700df1a9da58d |
| classificationCPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-16152
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-16225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-32225
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-12044
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-15311
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73253
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2224-73204
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/Y10T428-31663
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01L2924-00014
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-045
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-18
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-16
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K5-09
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-80
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08G77-70 |
| classificationCPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01C1-084
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-10
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C09K5-08
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/H01B1-24
http://rdf.ncbi.nlm.nih.gov/pubchem/patentcpc/C08L83-04 |
| classificationIPCAdditional |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K5-09 |
| classificationIPCInventive |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C09D5-25
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/H01C1-084
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-04
http://rdf.ncbi.nlm.nih.gov/pubchem/patentipc/C08K3-08 |
| filingDate |
2003-09-08^^<http://www.w3.org/2001/XMLSchema#date> |
| inventor |
http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_cfcdca61ec084865a9df3c6af529559b |
| publicationDate |
2004-05-06^^<http://www.w3.org/2001/XMLSchema#date> |
| publicationNumber |
WO-2004038732-A1 |
| titleOfInvention |
Heat softening thermally conductive compositions and methods for their preparation |
| abstract |
A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired softening temperature. |
| isCitedBy |
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-9909020-B2
http://rdf.ncbi.nlm.nih.gov/pubchem/patent/US-10888896-B2 |
| priorityDate |
2002-10-17^^<http://www.w3.org/2001/XMLSchema#date> |
| type |
http://data.epo.org/linked-data/def/patent/Publication |