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filingDate 2006-12-12^^<http://www.w3.org/2001/XMLSchema#date>
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publicationDate 2007-07-12^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2007078799-A2
titleOfInvention Low resistivity package substrate and its manufacturing method
abstract A method includes forming a coating on a land contact (210) of a package substrate, the coating including a first material (240) disposed between a first layer (230) and a second layer (250), each of the first layer and the second layer being made of a second material including gold. Am apparatus includes a package substrate including a plurality of land contacts wherein each of the plurality of land contacts includes a coating including a first material disposed between a first layer and a second layer, each of the first layer and the second layer being made of a second material including gold.
priorityDate 2005-12-28^^<http://www.w3.org/2001/XMLSchema#date>
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