| abstract |
A resin composition for encapsulating fillers which, in a continuous voltage application test under high-temperature high-humidity conditions, does not induce electrode corrosion in the wiring circuit board and which has satisfactory stability at ordinary temperature. The resin composition contains a polyamic acid and/or a polyimide. The polyamic acid preferably is one represented by the following general formula (1): (1) wherein Ar1 represents a tetravalent organic group; Ar2 represents a divalent organic group; and l is an integer of 1 or larger. The polyimide preferably is one represented by the following general formula(2): (2) wherein Ar3 represents a tetravalent organic group; Ar4 represents a divalent organic group; and m is an integer of 1 or larger. |