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filingDate 2010-12-07^^<http://www.w3.org/2001/XMLSchema#date>
inventor http://rdf.ncbi.nlm.nih.gov/pubchem/patentinventor/MD5_638af51988eeb631bb1dd0b9ad95dfb7
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publicationDate 2011-06-23^^<http://www.w3.org/2001/XMLSchema#date>
publicationNumber WO-2011073057-A1
titleOfInvention System to improve coreless package connections and associated methods
abstract A system to improve core package connections may include ball grid array pads, and a ball grid array. The system may also include connection members of the ball grid array conductively connected to respective ball grid array pads. The system may further include magnetic underfill positioned adjacent at least some of the connection members and respective ball grid array pads to increase respective connection members inductance.
priorityDate 2009-12-19^^<http://www.w3.org/2001/XMLSchema#date>
type http://data.epo.org/linked-data/def/patent/Publication

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