| abstract |
The present invention provides a curable composition for semiconductor encapsulation which gives a cured object excellent in terms of heat resistance, high-temperature electrical insulating properties, flexibility, and heat cycle resistance. Also provided is a semiconductor device encapsulated by curing this curable composition. The curable composition for semiconductor encapsulation comprises a specific SiH-containing siloxane compound as ingredient (A), a specific vinyl-containing siloxane compound as ingredient (B), a compound having at least three SiH or vinyl groups as ingredient (C), and a hydrosilylation catalyst as ingredient (D). |