abstract |
The present invention is a latent curing agent composition comprising (A) an adduct obtained by reacting (a) an amine compound having an active hydrogen group and (b) a polyglycidyl compound, and (B) a curing agent composition for epoxy resin containing phenol resin, characterized in that the phenol resin comprises 10 to 40 mass% of a dikaryon, and the number average molecular weight (Mn) is 900 to 2,000, the weight average molecular weight (Mw) is 2,500 to 5,000, and the molecular weight distribution (Mw/Mn) is 2.0 to 4.0. |